Spring loaded Test Terminals
Spring-loaded terminal for fast multipoint testing of PCB sub-assemblies during development and production.
Designed to be pressed or epoxy bonded into pre-planned test beds, aligned with the track and pins of the board to be tested.
Stock No. 521-601 has a gold-plated brass concave probe for locating PCB pins and solder joints.
Stock No. 521-611 has a nickel plated carbon-steel pointed probe for making contact to flat track and pads.
Probe is housed in a gold-plated brass body with a gold plated spring steel spring.
Solder posts connection to terminals
Recommended test-bed thickness: 5mm min. (epoxy bonded) 12mm max., (press fit)
15 mm max.
Concave Probe 521-601
Pointed Probe 521-611
Mounting hole size
2.00mm
Probe Travel
3.18mm max
Spring Pressure
0.54 ∼ 0.75N
Current Rating
2A
Contact Resistance
50mΩ
Contact Plating
Gold
Nickel
Attribute Type
Attribute Value
Pitch
3.2mm
Length
27.18mm
Current Rating
2A
Contact Resistance
50mΩ
