Backplanes & Motherboards

Single-Sided Eurocard Backplanes A 64-way single-sided Eurocard backplane suitable for use with 64//96 (a/c) DIN 41612 indirect edge connectors, in conjunction with Eurocard sub-racks to DIN 41494, e.g. the RS eurocard sub-rack system (except 4HP and 10HP card fronts).,Dimensions: Height 3U. Width 84HP. Pitch 0.6 in (15.24 mm). Lines 1, 2, 31 and 32 (a and c) are fully bussed for 3 rail and 0V power distribution.The absence of a grounding plane makes this backplane ideal for slow-speed non critical applications.,Mounting arrangements onto the RS sub-rack system is as depicted for the double-sided type Supplied with 2 insulated mounted strips PC / VME Bus Boards PC Compatible Prototyping Boards Prototyping boards manufactured from epoxy glass material to BS 4584 part 3 or 16. Card thickness is 1.6 mm. Copper is 305 g/m (1 oz/ft). Edge connector fingers are gold plated to a thickness of 1.5 microns. 1.0 mm (0.040 in.). Diameter holes are pre-drilled on a 2.54 mm (0.1 in.) matrix. Microboard Pattern Incorporates, on the component side of the card, a colander ground plane for maximum screening and glitch free high speed operation, and complete solder mask protection.

Eurocard Backplanes, Double-Sided Double sided backplanes 3U high with pth for high reliability which will accept DIN41612 connectors. Suitable for use with subracks to IEC297-3. 96//96-way suitable for high speed logic systems where screening is required between each signal line. Can also be used for slower applications with a maximum of 84 seperate signal lines by breaking the 0V commoning line in the end position Supplied with 2 insulated mounting strips PC / VME Bus Boards PC Compatible Prototyping Boards Prototyping boards manufactured from epoxy glass material to BS 4584 part 3 or 16. Card thickness is 1.6 mm. Copper is 305 g/m (1 oz/ft). Edge connector fingers are gold plated to a thickness of 1.5 microns. 1.0 mm (0.040 in.). Diameter holes are pre-drilled on a 2.54 mm (0.1 in.) matrix. Microboard Pattern Incorporates, on the component side of the card, a colander ground plane for maximum screening and glitch free high speed operation, and complete solder mask protection.