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122AB2000B, ABL Components

Heat Sink 122AB Series, 200mm Wide x 15mm High ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.

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350AB1500B, ABL Components

Flatback 125mm Wide x 50mm High With Channel ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. Note Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins.

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PPC0200BP, ABL Components

T0220 Clip-On, 9°C/W, 11°C/W It is recommended that the effectiveness of any heatsink is tested in the specific operating environment in which it will be subjected

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193AB2500B, ABL Components

Flatback 240mm Wide x 46mm High With Mounting Feet Note Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins.

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350AB1000B, ABL Components

Flatback 125mm Wide x 50mm High With Channel ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. Note Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins.

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122AB1000B, ABL Components

Heat Sink 122AB Series, 200mm Wide x 15mm High ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. The high powered Heat sink range pressed fin technology to achieve fin ratios and performance way beyond what is achievable from a single piece extrusion.

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520AB1000MB, ABL Components

Non Standard Extrusion 88mm Wide x 35mm High With Channel ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes. Note Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins.

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125AB2500B, ABL Components

Flatback 200mm Wide x 25mm High It is recommended that the effectiveness of any heatsink is tested in the specific operating environment in which it will be subjected Note Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins.

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BGA STD 090, ABL Components

BGA Heatsink, Standard Standard type BGA heatsink suitable for a variety of applications. BGA Heatsinks

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PPN0750B, ABL Components

PPN Series, TO220 Board Mount, Clip-On ABL heatsinks suitable for a wide range of applications.

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ILA-HSINK-STAR-50X80MM-RED-K, Intelligent LED Solutions

Heat Sink Kits for Intelligent LED Solutions PowerStar and PowerCluster LED Arrays The ILA-HEATSINK-XXX series of aluminium alloy heat sink kits are for use with Intelligent LED Solutions standard range of PowerStar and PowerCluster LED arrays. These anodised extruded heat sinks are supplied with Thermal Interface Material (TIM) attached to the top surface and fixing screws for the LED array and for fixing to a base plate. They are available in a range of colours: black, red, silver and blue. Anodised extruded aluminium heatsink kits Supplied with: Thermal Interface Material (TIM) and fixing screws

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ILA-HSINK-STAR-50X80MM-BLU-K, Intelligent LED Solutions

Heat Sink Kits for Intelligent LED Solutions PowerStar and PowerCluster LED Arrays The ILA-HEATSINK-XXX series of aluminium alloy heat sink kits are for use with Intelligent LED Solutions standard range of PowerStar and PowerCluster LED arrays. These anodised extruded heat sinks are supplied with Thermal Interface Material (TIM) attached to the top surface and fixing screws for the LED array and for fixing to a base plate. They are available in a range of colours: black, red, silver and blue. Anodised extruded aluminium heatsink kits Supplied with: Thermal Interface Material (TIM) and fixing screws

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Heatsinks

New Items

122AB2000B, ABL Components

350AB1500B, ABL Components

PPC0200BP, ABL Components

193AB2500B, ABL Components

350AB1000B, ABL Components

122AB1000B, ABL Components

520AB1000MB, ABL Components

125AB2500B, ABL Components

BGA STD 090, ABL Components

PPN0750B, ABL Components

ILA-HSINK-STAR-50X80MM-RED-K, Intelligent LED Solutions

ILA-HSINK-STAR-50X80MM-BLU-K, Intelligent LED Solutions

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