Bluetooth Modules

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RN52-I/RM116, Microchip

The RN52 Bluetooth audio module provides a fully integrated solution for delivering high-quality stereo audio in a small form factor. It combines a Class 2 Bluetooth radio with an embedded DSP processor, controlled and configured by simple ASCII commands and GPIO. It integrates RF, a baseband controller, and DSP, making it a complete Bluetooth audio wireless link. The RN52 supports HSP/HFP, A2DP, AVRCP, SPP, and iAP profiles. The RN52 is easily integrated into any system via a simple UART interface. Bluetooth version 3.0 audio module, fully compatible with Bluetooth version 2.1+EDR, 1.2, and 1.1 Software configurable through commands over UART console interface Embedded Bluetooth stack profiles: SPP, A2DP, HFP/HSP, and AVRCP Supports iAP profile discovery for iPhone® and iPod® Bluetooth accessories Postage-stamp-sized form factor, 13.5 x 26 x 2.7mm Dual-channel, differential audio input and output for highest quality audio

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EYSGCNZWY, Taiyo Yuden

RF TXRX MOD BLUETOOTH CHIP ANT

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410-214, Digilent

Pmod BT2 Bluetooth 2.1 Module The Pmod BT2 provides Bluetooth 2.1 wireless communication through an RN-42 radio transceiver module. Bluetooth 2.1/2.0/1.2/1.0 protocol compatible Class 2 device with range up to 10m (line-of-sight) Supports HID profile for making accessories such as pointing devices Security: 128-bit encryption Supports Bluetooth data link to iPhone/iPad/iPod Touch Six selectable operating modes 12-pin Pmod port with UART interface Dimensions: 38 x 20mm

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450-0184, Laird Connectivity

The Laird Connectivity SaBLE-x-R2 is an Evaluation Kit with PCB Trace Antenna. SaBLE-x-R2 module fully supports the single mode Bluetooth Low Energy operation and the output power can support class 2. 128 kB Flash/20 kB SRAM Size: 11.6 mm x 17.9 mm x 2.4 mm Operating Voltage: 1.8V to 3.8V Operating Temperature: -40 to +85C 61μA/MHz Active CPU Current

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451-00001, Laird Connectivity

The Laird Connectivity Development Kit with an integrated antenna. BL654 Series module is designed to simplify OEMs enablement of Bluetooth Low Energy (BLE) v5.1 and thread (802.15.4) to small, portable, power-conscious devices. 802.15.4 (Thread) radio support Multiple programming options Ultra-low power consumption

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DVK-BT850-SA, Laird Connectivity

The Laird Connectivity development Kit with an integrated antenna for BT850-SA module. BT85x series of USB HCI modules and Adapter leverage the Cypress CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs nee Bluetooth v5.0 - Dual Mode 2-wire Cypress Global Coexistence Interface (GCI) High antenna radiation gain and efficiency Good interference rejection for multi-com system (GSM/WCDMA)

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DVK-RM186-SM, Laird Connectivity

The Laird Connectivity Development board with RM186-SM module soldered in place. RM1xx Series module is designed to enable OEMs to add a long range Lora radio link and either Central OR Peripheral mode Bluetooth Low Energy (BLE) to small, portable, power- On-board BLE chip antenna smart BASIC programming language Long range – Lora range up to 15 km Compact footprint

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CYW954907AEVAL1F, Infineon

Cypress Semiconductor Bluetooth evaluation board The Cypress semiconductor Bluetooth evaluation board is a device that enables you to evaluate and develop single-chip Wi-Fi applications using the CYW54907 device. It is single-chip 802.11ac dual-band (2.4 GHz and 5 GHz) Wi-Fi SoC that features 320-MHz Arm Cortex-R4 MCU device. This kit is supported in WICED Studio IDE. The Arduino compatibility allows to plugin off the shelf shields to expand hardware functionality for quick prototyping. Features and Benefits 5V to 12V input using USB connector or power jack Arduino compatible headers for hardware expansion Custom header to bring out additional GPIOs (WICED header) On-board PCB antenna with an option to connect external antenna On-board programmer and debugger using USB interface and USB-UART bridge One USB 2.0 Type-A to Micro-B cable RJ45 connector for Ethernet User switches and LEDs Applications Embedded IoT

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BM64SPKS1MC1-0003AA, Microchip

The Microchip BM64 stereo audio module is a fully-certified Bluetooth module for designers who want to add Bluetooth wireless audio and voice applications to their products. This Bluetooth SIG certified module provides a complete wireless solution with Bluetooth stack, integrated antenna, and worldwide radio certifications in a compact surface mount package. This stereo module has integrated Li-Ion charger and contains a digital audio interface. It supports HSP, HFP, SPP, A2DP (Sink), and AVRCP profiles. Both AAC and SBC codecs are supported for A2DP.Bluetooth Low Energy supports standard Generic Access Service, Device Information Service and a proprietary service for data communication On-board Bluetooth Stack Class 2 module with +2 dBm (typical) output power and Class 1 module with +15 dBm (typical) output power Transparent UART mode for seamless serial data over UART interface Easy to configure with User Interface (UI) tool, a Windows® configuration utility or directly by MCU USB firmware upgrade supported Supports both digital audio I2S format and analogue audio output Castellated surface mount pads for easy and reliable host PCB mounting Ideal for portable battery-operated devices Internal battery regulator circuitry On-board antenna

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CYBT-343026-01, Cypress Semiconductor

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CY5676A, Cypress Semiconductor

CY5676A PRoC BLE 256KB Module with Bluetooth 4.2, Cypress The CY5676A PRoC BLE 256 KB Module is qualified for the Bluetooth 4.2 specification. It enables you to evaluate and add Bluetooth Low Energy (BLE) connectivity to an embedded system. The module can be used with the Bluetooth Low Energy Pioneer Kit (CY8CKIT-042-BLE) and PSoC Creator software to develop BLE applications. The CY5674 can also be programmed and debugged with the PSoC MiniProg3 Program and Debug Kit (CY8CKIT-002) and PSoC Creator software. Then it can operate standalone. The CY5676A can be used with the CY5677 CySmart BLE 4.2 USB Dongle to test and debug Bluetooth 4.2 features. Dimensions 45 x 27 x 2 mm

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450-0155, Laird Connectivity

The Laird Connectivity Sterling-LWB SD is a development board for 450-0155 module. Sterling-LWB is a high performance 2.4 GHz WLAN and Bluetooth combo module based on latest-generation silicon (Broadcoms BCM4343W). Operating voltage: 3.0V to 3.6V Operating temperature: -40o to +85o C Storage temperature: -40° to +125°C Bluetooth v4.2 BR /DR/LE WLAN and Bluetooth coexistence

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New Items

RN52-I/RM116, Microchip

EYSGCNZWY, Taiyo Yuden

410-214, Digilent

450-0184, Laird Connectivity

451-00001, Laird Connectivity

DVK-BT850-SA, Laird Connectivity

DVK-RM186-SM, Laird Connectivity

CYW954907AEVAL1F, Infineon

BM64SPKS1MC1-0003AA, Microchip

CYBT-343026-01, Cypress Semiconductor

CY5676A, Cypress Semiconductor

450-0155, Laird Connectivity

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