MBO

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Featured Products

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GEL FLUX MOB 39 - SERINGUE DE 10CC, MBO

MOB39 Solder Flux Gel MOB39 Solder Flux Gel is for descaling surfaces prior to application of solder paste...

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GRENAILLE SN99 AG0.3 CU0.7 - POT 500G, MBO

Bars and granules SN99 AG0.3 CU0.7 Lead-free alloy for use with wave soldering machines and tinning crucibl...

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SN60 PB 12/10 - 3 CANAUX A11 - 100G, MBO

AUTOFIL A11 Sn60Pb40 activated solder wire Activated No-Clean solder alloy with incorporated resinous flux. Designed for industrial applications...

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300AG 8/10 CR2 - 500G, MBO

HT silver solder wire Ag300 High-temperature three-metal alloy Pb93.5 Sn5 Ag1.5. Application: soldering with a high melting point for applicatio...

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SN60 PB40 10/10 SANS NETTOYAGE RT15 - 500G, MBO

AUTOFIL RT15 solder wire Sn60Pb40 Non-activated No-Clean solder alloy with incorporated resinous flux. Designed for SMD repair applications. Exc...

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BAGUETTE SN60 PB40 HT, MBO

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CRÈME SN96.5 AG3 CU0.5 SIRIUS 1 LF - SERINGUE MANU, MBO

Sirius 1 LF solder paste Sn96.5 Ag3 Cu0.5 No-Clean solder paste suitable for stencil printing for reflow processes....

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SN96.5 AG3 CU0.5 10/10 RT15 - 100G, MBO

Solder Wire Sn96.5 Ag3 Cu0.5 No-clean solder wire (RT15) and activated no-clean solder wire (A11). A11 spools are d...

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SN96.5 AG3 CU0.5 10/10 RT15 - 500G, MBO

Solder Wire Sn96.5 Ag3 Cu0.5 No-clean solder wire (RT15) and activated no-clean solder wire (A11). A11 spoo...

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SN96.5 AG3 CU0.5 5/10 A11 - 500G, MBO

Solder Wire Sn96.5 Ag3 Cu0.5 No-clean solder wire (RT15) and activated no-clean solder wire (A11). A11 spools are designed for soldering connect...

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SN60 PB CU2 12/10 - 3 CANAUX A11 - 500G, MBO

AUTOFIL A11 Sn60Pb38Cu activated solder wire Activated No-Clean solder alloy with incorporated resinous flux. Designed for industrial applicatio...

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SN96.5 AG3 CU0.5 15/10 RT15 - 500G, MBO

Solder Wire Sn96.5 Ag3 Cu0.5 No-clean solder wire (RT15) and activated no-clean solder wire (A11). A11 spoo...

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Popular Categories For MBO

Solder Masks (1)

Solder (50)

Soldering Accessories (1)

Solder Pastes (1)

Solder Flux (1)

Popular Items

Popular items

GEL FLUX MOB 39 - SERINGUE DE 10CC, MBO

MOB39 Solder Flux Gel MOB39 Solder Flux Gel is for descaling surfaces prior to application of solder paste in stencil printing or spot application processes. It is also used for repairing printed circuit boards. Non-corrosive residues avoid needing to clean the printed circuit board after soldering. Syringe/ Dispenser/ Bottles

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GRENAILLE SN99 AG0.3 CU0.7 - POT 500G, MBO

Bars and granules SN99 AG0.3 CU0.7 Lead-free alloy for use with wave soldering machines and tinning crucibles. Complies with Directive RoHS 2002 / 95 / CE. Leaded Stick Solder

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Popular items

SN60 PB 12/10 - 3 CANAUX A11 - 100G, MBO

AUTOFIL A11 Sn60Pb40 activated solder wire Activated No-Clean solder alloy with incorporated resinous flux. Designed for industrial applications in the electronics and connector industries. Excellent wetting on tin-plated substrates. Generates minimal fumes and residue. Chlorine content: 1.1 % Class: J-STD-004 ROM1

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300AG 8/10 CR2 - 500G, MBO

HT silver solder wire Ag300 High-temperature three-metal alloy Pb93.5 Sn5 Ag1.5. Application: soldering with a high melting point for applications in the lamp, motors, the mechanical industry or soldering that requires a more malleable joint.

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Popular items

SN60 PB40 10/10 SANS NETTOYAGE RT15 - 500G, MBO

AUTOFIL RT15 solder wire Sn60Pb40 Non-activated No-Clean solder alloy with incorporated resinous flux. Designed for SMD repair applications. Excellent wetting on tin-plated substrates. Generates minimal fumes and residue. Chlorine: 0 %. Flux ratio: 1.5 %. Class J-STD-004 ROL0.

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BAGUETTE SN60 PB40 HT, MBO

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CRÈME SN96.5 AG3 CU0.5 SIRIUS 1 LF - SERINGUE MANU, MBO

Sirius 1 LF solder paste Sn96.5 Ag3 Cu0.5 No-Clean solder paste suitable for stencil printing for reflow processes. Fine pitch capability (400 μm). High activity. Minimal residue, neutral and colourless. Chlorine-free. Solder Paste - Lead Free

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Popular items

SN96.5 AG3 CU0.5 10/10 RT15 - 100G, MBO

Solder Wire Sn96.5 Ag3 Cu0.5 No-clean solder wire (RT15) and activated no-clean solder wire (A11). A11 spools are designed for soldering connectors to all substrates. RT15 spools with fast wetting are suitable for SMD repairs.

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SN96.5 AG3 CU0.5 10/10 RT15 - 500G, MBO

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SN96.5 AG3 CU0.5 5/10 A11 - 500G, MBO

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SN60 PB CU2 12/10 - 3 CANAUX A11 - 500G, MBO

AUTOFIL A11 Sn60Pb38Cu activated solder wire Activated No-Clean solder alloy with incorporated resinous flux. Designed for industrial applications in the electronics and connector industries. Excellent wetting on tin-plated substrates. Generates minimal fumes and residue. Chlorine content: 1.1 % Class: J-STD-004 ROM1

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Popular items

SN96.5 AG3 CU0.5 15/10 RT15 - 500G, MBO

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