Multicore

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291482, Multicore

'Savbit® Solder Contains a small amount of copper which reduces wear of soldering iron bits and enables fine copper wires to be soldered more e...

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288548, Multicore

Multicore Crystal™ No-Clean Flux A careful balance of resins and activators provides clear residues without...

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288155, Multicore

Rosin-Free 60//40 Tin/Lead Solder Rosin-free solder for fast and sustained soldering on copper and brass....

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291319, Multicore

Multicore Crystal™ No-Clean Flux A careful balance of resins and activators provides clear residues without...

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291467, Multicore

'Savbit® Solder Contains a small amount of copper which reduces wear of soldering iron bits and enables fine copper wires to be soldered more e...

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291749, Multicore

Low Melting Point (L.M.P.) Solder A tin/lead solder which exhibits a very sharp (eutectic) melting transition and i...

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288520, Multicore

Multicore Crystal™ No-Clean Flux A careful balance of resins and activators provides clear residues without...

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583773, Multicore

Solder with incorporated flux 96SC Crystal 502 No-Clean solder wire with incorporated flux. Constant heat, low spatter. High speed soldering, ran...

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288718, Multicore

Multicore Crystal™ No-Clean Flux A careful balance of resins and activators provides clear residues without the need for cleaning in most applic...

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291345, Multicore

Aluminium Metal Jointing Solder Ideal for jointing aluminium, tin-plated brass, nickel, copper or stainless steel but is not suitable for elec...

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287908, Multicore

40//60 Tin/Lead Solder This solder is more suitable for making/repairing copper and brass metalware. 5 cores of Ersin® flux % Tin (Sn) 40...

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289190, Multicore

60//40 Tin/Lead Solder X39 Very low residue no clean flux for good quality components / PCBs. 2 cores % Tin (Sn) 60 % Lead (Pb) 40 Appr...

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Solder (12)

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291482, Multicore

'Savbit® Solder Contains a small amount of copper which reduces wear of soldering iron bits and enables fine copper wires to be soldered more efficiently. 5 cores of Ersin® flux Reel weight 500 g % Tin (Sn) 50 % Lead (Pb) 48.5 % Copper (Cu) 1.5 Approx Melting Point °C 183-215 Standards Conforms to BS441 Type 1, DTD599A and DIN8516. Approvals BS441; Type 1; DTD 599A; DIN 8516 Standards Conforms to BS441 Type 1, DTD599A and DIN8516

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288548, Multicore

Multicore Crystal™ No-Clean Flux A careful balance of resins and activators provides clear residues without the need for cleaning in most applications. Crystal™ 400 is halide-free and is suitable for soldering copper, brass and nickel ( RS 229-4263 ) Crystal™ 511 is suitable for badly oxidised surfaces and materials with inherently poor solderability ( RS 229-4308 ) % Tin (Sn) 60 % Lead (Pb) 40 Approx Melting Point °C 183-188 Standards IPC Reliability rating LR3CN for Crystal 400 and MR3CN for Crystal 511. Approvals 7777 Standards IPC Reliability rating LR3CN for Crystal 400 and MR3CN for Crystal 511

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288155, Multicore

Rosin-Free 60//40 Tin/Lead Solder Rosin-free solder for fast and sustained soldering on copper and brass. 5 Cores of Ecosol® 105 Rosin (Colophony) free flux Similar performance to traditional solders High activity - no dewetting Approximate melting point of solder: 183-188°C % Tin (Sn) 60 % Lead (Pb) 40 Approx. Melting Point °C 183-188

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291319, Multicore

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291467, Multicore

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291749, Multicore

Low Melting Point (L.M.P.) Solder A tin/lead solder which exhibits a very sharp (eutectic) melting transition and is ideal for repairs on fabricated boards. Thermal damage to components can be minimised due to lower temperatures 5 cores of Ersin® flux % Tin (Sn) 62 % Lead (Pb) 36 % Silver (Ag) 2 Approx Melting Point °C 179 Standards Conforms to BS219 Grade 62S, DIN1707. Approvals BS219 Grade 62S; DIN 1707 Standards Conforms to BS219 Grade 62S, DIN1707

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288520, Multicore

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583773, Multicore

Solder with incorporated flux 96SC Crystal 502 No-Clean solder wire with incorporated flux. Constant heat, low spatter. High speed soldering, range of activities suitable for all applications. Good spread on copper, brass and nickel. Clear residue. Halide content: 0.2%.

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288718, Multicore

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291345, Multicore

Aluminium Metal Jointing Solder Ideal for jointing aluminium, tin-plated brass, nickel, copper or stainless steel but is not suitable for electrical joints. Soft solder with low melting point which enables it to be used in place of previously brazed/welded joints 4 cores of Alu-Sol® flux % Tin (Sn) 18 % Lead (Pb) 80 % Silver (Ag) 2 Approx Melting Point °C 178-270 Note not suitable for electrical joints. Approvals 7777

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287908, Multicore

40//60 Tin/Lead Solder This solder is more suitable for making/repairing copper and brass metalware. 5 cores of Ersin® flux % Tin (Sn) 40 % Lead (Pb) 60 Approx Melting Point °C 183-234 Standards Conforms to BS441 Type 1, DTD599A, DIN 8516. Approvals BS441; Type 1; DTD599A; DIN 8516

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289190, Multicore

60//40 Tin/Lead Solder X39 Very low residue no clean flux for good quality components / PCBs. 2 cores % Tin (Sn) 60 % Lead (Pb) 40 Approx Melting Point °C 183-188

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