Solder Pastes

New items

Loctite LF 318 96 SCA BK, Loctite

The Loctite LF 318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste, formulated to have excellent humidity resistance and a broad process window, both for reflow and printing. This product has a high tack force to resist component movement during high speed placement and long printer abandon times. Good humidity resistance Clear residues for easy post-reflow inspection. Soft, non-stick, pin testable residues allow easy in-circuit testing Extended open time and tack-life leading to low wastage

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New items

SMD291AX50T3, CHIPQUIK

Solder Paste in jar 50g (T3) Sn63/Pb37 no clean 90.25% metal. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Print grade Compatible with enclosed print heads Passes BONO test

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New items

SMD4300SNL10, CHIPQUIK

Solder Paste no clean Lead-Free in 10cc syringe 35g water washable w/plunger & tip. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test @1.56% RoHS II and REACH compliant

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New items

SMD291SNL, CHIPQUIK

Solder Paste no clean Lead-Free in 5cc syringe 15g w/plunger & tip. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test @1.56% RoHS II and REACH compliant

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New items

SMD291AX, CHIPQUIK

Solder Paste no clean 63Sn/37Pb in 5cc syringe 15g w/plunger & tip. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test

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New items

CW8700, Circuitworks

Lead Free Tacky Flux Specifically formulated for the higher temperature requirements of lead free applications Syringe applicator provides exact delivery of flux to surface Long tack time, extended shelf life No refrigeration required Noncorrosive, halide and halogen free Meets IPC requirements for ROL0, No Clean Excellent consistency with stable viscosity CW8700 3.5 gm (0.12 oz) Syringe Applications: Ideal for lead-free BGA rework applications requiring higher activation temperatures Standards ISO 9454, DIN EN 29454-1, RoHS Compliant Standards ISO 9454, DIN EN 29454-1, RoHS Compliant Syringes

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New items

SMD291SNL10T5, CHIPQUIK

Solder Paste no clean Lead-Free in 10cc syringe T5 Mesh SAC305. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test @1.56% RoHS II and REACH compliant

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New items

SMD291SNL50T3, CHIPQUIK

Solder Paste in jar 50g (T3) SAC305 no clean 88.5% metal. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Print grade Compatible with enclosed print heads Passes BONO test @1.56% RoHS II and REACH compliant

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New items

SMD291SNL250T3, CHIPQUIK

Solder Paste in jar 250g (T3) SAC305 no clean 88.5% metal. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Print grade Compatible with enclosed print heads Passes BONO test @1.56% RoHS II and REACH compliant

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New items

SMDLTLFP, CHIPQUIK

Solder Paste Lead-Free Sn42/Bi57.6/Ag0.4 no clean Low Temperature Melts 138C 281F eutectic. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads RoHS II and REACH compliant

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New items

Loctite MP 218, Loctite

The Loctite MP 218 solder paste is a halide-free, no clean, pin testable solder paste, which has excellent humidity resistance and a broad process window, both for reflow and printing. LOCTITE MP 218 has high tack force to resist component movement during high speed placement, long printer abandon times and excellent solderability over a wide range of reflow profiles in air and nitrogen and across a wide range of surface finishes including HASL, Ni/Au, Immersion Sn, Immersion Ag and OSP copper. Colourless residues for easy post-reflow inspection Soft, non-stick, pin testable residues allow easy in-circuit testing Suitable for fine pitch, high speed printing up to 150mm/s (6"/s)

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New items

SMD291AX10, CHIPQUIK

Solder Paste no clean 63Sn/37Pb in 10cc syringe 35g w/plunger & tip. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test

Product Detail

New Items

Loctite LF 318 96 SCA BK, Loctite

SMD291AX50T3, CHIPQUIK

SMD4300SNL10, CHIPQUIK

SMD291SNL, CHIPQUIK

SMD291AX, CHIPQUIK

CW8700, Circuitworks

SMD291SNL10T5, CHIPQUIK

SMD291SNL50T3, CHIPQUIK

SMD291SNL250T3, CHIPQUIK

SMDLTLFP, CHIPQUIK

Loctite MP 218, Loctite

SMD291AX10, CHIPQUIK

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