Solder Pastes

New items

SMD291AX50T3, CHIPQUIK

Solder Paste in jar 50g (T3) Sn63/Pb37 no clean 90.25% metal. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Print grade Compatible with enclosed print heads Passes BONO test

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New items

SMD291SNL, CHIPQUIK

Solder Paste no clean Lead-Free in 5cc syringe 15g w/plunger & tip. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test @1.56% RoHS II and REACH compliant

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New items

SMD4300SNL10, CHIPQUIK

Solder Paste no clean Lead-Free in 10cc syringe 35g water washable w/plunger & tip. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test @1.56% RoHS II and REACH compliant

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New items

SMD291AX, CHIPQUIK

Solder Paste no clean 63Sn/37Pb in 5cc syringe 15g w/plunger & tip. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test

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New items

CW8700, Circuitworks

Lead Free Tacky Flux Specifically formulated for the higher temperature requirements of lead free applications Syringe applicator provides exact delivery of flux to surface Long tack time, extended shelf life No refrigeration required Noncorrosive, halide and halogen free Meets IPC requirements for ROL0, No Clean Excellent consistency with stable viscosity CW8700 3.5 gm (0.12 oz) Syringe Applications: Ideal for lead-free BGA rework applications requiring higher activation temperatures Standards ISO 9454, DIN EN 29454-1, RoHS Compliant Standards ISO 9454, DIN EN 29454-1, RoHS Compliant Syringes

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New items

SMD291SNL10T5, CHIPQUIK

Solder Paste no clean Lead-Free in 10cc syringe T5 Mesh SAC305. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test @1.56% RoHS II and REACH compliant

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New items

SMD291SNL50T3, CHIPQUIK

Solder Paste in jar 50g (T3) SAC305 no clean 88.5% metal. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Print grade Compatible with enclosed print heads Passes BONO test @1.56% RoHS II and REACH compliant

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New items

SMD291SNL250T3, CHIPQUIK

Solder Paste in jar 250g (T3) SAC305 no clean 88.5% metal. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Print grade Compatible with enclosed print heads Passes BONO test @1.56% RoHS II and REACH compliant

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New items

SMDLTLFP, CHIPQUIK

Solder Paste Lead-Free Sn42/Bi57.6/Ag0.4 no clean Low Temperature Melts 138C 281F eutectic. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads RoHS II and REACH compliant

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New items

SMDLTLFP50T3, CHIPQUIK

Solder Paste in jar 50g (T3) Sn42/Bi57.6/Ag0.4 Low Temperature 90% metal melts @ 138C, 281F. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Print grade Compatible with enclosed print heads RoHS II and REACH compliant

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New items

SMD291AX10, CHIPQUIK

Solder Paste no clean 63Sn/37Pb in 10cc syringe 35g w/plunger & tip. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test

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New items

CRÈME SN62 PB AG2 SIRIUS 1 - SERINGUE MANU 30G, MBO

Sirius 1 solder paste Sn62 Pb Ag2 No-Clean solder paste suitable for stencil printing in reflow processes. Fine pitch capability (400 μm). High activity. Minimal residue, neutral and colourless. Chlorine-free. Standards NFC90550; J-STD-006; EN 29453 Solder Paste - Leaded

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New Items

SMD291AX50T3, CHIPQUIK

SMD291SNL, CHIPQUIK

SMD4300SNL10, CHIPQUIK

SMD291AX, CHIPQUIK

CW8700, Circuitworks

SMD291SNL10T5, CHIPQUIK

SMD291SNL50T3, CHIPQUIK

SMD291SNL250T3, CHIPQUIK

SMDLTLFP, CHIPQUIK

SMDLTLFP50T3, CHIPQUIK

SMD291AX10, CHIPQUIK

CRÈME SN62 PB AG2 SIRIUS 1 - SERINGUE MANU 30G, MBO

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