Dimensions:
10.67 x 8.84 x 4.58mm
Mounting Type:
Surface Mount
Maximum Power Dissipation:
100 W
Package Type:
TO-263AB
Number of Elements per Chip:
1
Maximum Operating Temperature:
+175 °C
Pin Count:
2 + Tab
Transistor Configuration:
Single
FET Feature:
-
HTSUS:
8541.29.0095
Vgs(th) (Max) @ Id:
2V @ 250µA
Operating Temperature:
-65°C ~ 175°C (TJ)
Package / Case:
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Rds On (Max) @ Id, Vgs:
20mOhm @ 24A, 10V
Gate Charge (Qg) (Max) @ Vgs:
60 nC @ 5 V
RoHS Status:
ROHS3 Compliant
REACH Status:
REACH Unaffected
FET Type:
N-Channel
Drive Voltage (Max Rds On, Min Rds On):
5V, 10V
Package:
Tape & Reel (TR)
Drain to Source Voltage (Vdss):
60 V
Vgs (Max):
±16V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Power Dissipation (Max):
100W (Tc)
Input Capacitance (Ciss) (Max) @ Vds:
2000 pF @ 25 V
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
D²PAK (TO-263)
Current - Continuous Drain (Id) @ 25°C:
48A (Tc)
Technology:
MOSFET (Metal Oxide)
Base Product Number:
NDB6060
ECCN:
EAR99
