Microchip Technology MCP25020-I/SL

MCP25020-I-SL Microchip Technology MCP25020-I/SL
Microchip Technology

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Interrupt Output:
No
Number of I/O:
8
Operating Temperature:
-40°C ~ 85°C
Package / Case:
14-SOIC (0.154", 3.90mm Width)
REACH Status:
REACH Unaffected
Output Type:
Push-Pull
Interface:
CAN V2.0b
Package:
Tube
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Clock Frequency:
25 MHz
standardLeadTime:
27 Weeks
Current - Output Source/Sink:
25mA
Features:
EEPROM, POR, PWM
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
14-SOIC
Voltage - Supply:
2.75V ~ 5.5V
Base Product Number:
MCP25020
ECCN:
EAR99
Checking for live stock

This is manufactured by Microchip Technology. The manufacturer part number is MCP25020-I/SL. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. 8 is the I/O value of the product. The product has -40°c ~ 85°c operating temperature range. Moreover, the product comes in [Package/ Case]. In addition, it is reach unaffected. Furthermore, it has apush-pull output. A bespoke product is can v2.0b interface. It is shipped in tube. Its typical moisture sensitivity level is 1 (unlimited). The product boasts a clock frequency of 25 mhz. It has a long 27 weeks standard lead time. The splendid features of the product include eeprom, por, pwm. The product is available in surface mount configuration. 14-soic is the supplier device package value. It has optimum voltage supply of 2.75v ~ 5.5v. Moreover, it corresponds to mcp25020, a base product number of the product. The product is designated with the ear99 code number

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Microchip CA Prop65(Environmental Information)
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Microchip RoHS(Environmental Information)
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Microchip REACH(Environmental Information)
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Qualification Copper Bond Wire 31/Oct/2014(PCN Assembly/Origin)
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Copper Bond Wire 5/Nov/2015(PCN Design/Specification)
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MCP2502X/5X 27/Mar/2017(PCN Design/Specification)
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MCP2502X/5X Datasheet(Datasheets)
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Packing Changes 10/Oct/2016(PCN Packaging)
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Label and Packing Changes 23/Sep/2015(PCN Packaging)
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Development Tools Catalog(Other Related Documents)

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