NXP USA Inc. MC33HB2001EKR2518

MC33HB2001EKR2518 NXP USA Inc.
NXP USA Inc.

Product Information

HTSUS:
8542.39.0001
Supplier Device Package:
32-SOIC-EP
Operating Temperature:
-40°C ~ 150°C (TJ)
Package / Case:
32-SSOP (0.295", 7.50mm Width) Exposed Pad
Applications:
DC Motors, General Purpose
Interface:
SPI
Package:
Bulk
Load Type:
Inductive
Features:
Slew Rate Controlled
Mounting Type:
Surface Mount
Series:
-
Voltage - Load:
5V ~ 28V
Fault Protection:
Over Temperature, Over Voltage, UVLO
Voltage - Supply:
5V ~ 28V
Rds On (Typ):
125mOhm LS (Max), 125mOhm HS (Max)
Output Configuration:
Half Bridge (2)
Technology:
Power MOSFET
ECCN:
EAR99
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This is manufactured by NXP USA Inc.. The manufacturer part number is MC33HB2001EKR2518. It is assigned with possible HTSUS value of 8542.39.0001. 32-soic-ep is the supplier device package value. The product has -40°c ~ 150°c (tj) operating temperature range. Moreover, the product comes in [Package/ Case]. The product is widely employed in dc motors, general purpose. A bespoke product is spi interface. It is shipped in bulk. The splendid features of the product include slew rate controlled. The product is available in surface mount configuration. The given load voltage is 5v ~ 28v. Fault protection features include over temperature, over voltage, uvlo. It has optimum voltage supply of 5v ~ 28v. The typical Rds On of the product is 125mohm ls (max), 125mohm hs (max). It boasts half bridge (2) output configuration. This product use power mosfet technology. The product is designated with the ear99 code number

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