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TE Connectivity GA10K3MCD1 Thermistor 10kΩ, 0.5 (Dia.) x 155mm

GA10K3MCD1 TE Connectivity Thermistor 10kΩ, 0.5 (Dia.) x 155mm
GA10K3MCD1 TE Connectivity Thermistor 10kΩ, 0.5 (Dia.) x 155mm
TE Connectivity

Product Information

Dimensions:
0.5 x 155mm
Series:
Micro-BetaChip
Length:
155mm
Temperature Coefficient Type:
NTC
Tolerance:
±0.5%
Thermal Coefficient:
-4.39%/°C
Resistance @ 25 °C:
10kΩ
RoHs Compliant
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This is Thermistor 10kΩ 0.5 (Dia.) x 155mm manufactured by TE Connectivity. The manufacturer part number is GA10K3MCD1. The given dimensions of the product include 0.5 x 155mm. The product micro-betachip, is a highly preferred choice for users. Its accurate length is 155mm. It features ±0.5% of tolerance value.

pdf icon
Micro-BetaCHIP Thermistor Probe Datasheet(Technical Reference)

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FAQs

Yes. You can also search GA10K3MCD1 on website for other similar products.
We accept all major payment methods for all products including ET14114067. Please check your shopping cart at the time of order.
You can order TE Connectivity brand products with GA10K3MCD1 directly through our website or call us at +44 (0) 3303 800 157 or email our support team at sales@enrgtech.co.uk.
Yes. Our products in Thermistor ICs category are shipped in lowest possible time.
You will get a confirmation email regarding your order of TE Connectivity GA10K3MCD1 Thermistor 10kΩ, 0.5 (Dia.) x 155mm. You can also check on our website or by contacting our customer support team for further order details on TE Connectivity GA10K3MCD1 Thermistor 10kΩ, 0.5 (Dia.) x 155mm.
We use our internationally recognized delivery partners UPS/DHL. Collection of ET14114067 can also be arranged for the customer by international shipments through contacting our customer support team. Additionally, you can also search"TE Connectivity" products on our website by using Enrgtech's Unique Manufacturing Part Number GA10K3MCD1.
Yes. You can also search GA10K3MCD1 on website for other similar products.
Yes. We ship GA10K3MCD1 Internationally to many countries around the world.
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