Solder Pastes

New items

Loctite LF 318 96 SCA BK, Loctite

The Loctite LF 318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste, formulated to have excellent humidity resistance and a broad process window, both for reflow and printing. This product has a high tack force to resist component movement during high speed placement and long printer abandon times. Good humidity resistance Clear residues for easy post-reflow inspection. Soft, non-stick, pin testable residues allow easy in-circuit testing Extended open time and tack-life leading to low wastage

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New items

SMD291SNL, CHIPQUIK

Solder Paste no clean Lead-Free in 5cc syringe 15g w/plunger & tip. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test @1.56% RoHS II and REACH compliant

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New items

SMD291AX50T3, CHIPQUIK

Solder Paste in jar 50g (T3) Sn63/Pb37 no clean 90.25% metal. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Print grade Compatible with enclosed print heads Passes BONO test

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New items

SMD4300SNL10, CHIPQUIK

Solder Paste no clean Lead-Free in 10cc syringe 35g water washable w/plunger & tip. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test @1.56% RoHS II and REACH compliant

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New items

SMD291AX, CHIPQUIK

Solder Paste no clean 63Sn/37Pb in 5cc syringe 15g w/plunger & tip. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test

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New items

CW8700, Circuitworks

Lead Free Tacky Flux Specifically formulated for the higher temperature requirements of lead free applications Syringe applicator provides exact delivery of flux to surface Long tack time, extended shelf life No refrigeration required Noncorrosive, halide and halogen free Meets IPC requirements for ROL0, No Clean Excellent consistency with stable viscosity CW8700 3.5 gm (0.12 oz) Syringe Applications: Ideal for lead-free BGA rework applications requiring higher activation temperatures Standards ISO 9454, DIN EN 29454-1, RoHS Compliant Standards ISO 9454, DIN EN 29454-1, RoHS Compliant Syringes

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New items

SMD291SNL250T3, CHIPQUIK

Solder Paste in jar 250g (T3) SAC305 no clean 88.5% metal. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Print grade Compatible with enclosed print heads Passes BONO test @1.56% RoHS II and REACH compliant

Product Detail

New Items

Loctite LF 318 96 SCA BK, Loctite

SMD291SNL, CHIPQUIK

SMD291AX50T3, CHIPQUIK

SMD4300SNL10, CHIPQUIK

SMD291AX, CHIPQUIK

CW8700, Circuitworks

SMD291SNL250T3, CHIPQUIK

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