Solder Pastes

New items

Loctite LF 318 96 SCA BK, Loctite

The Loctite LF 318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste, formulated to have excellent humidity resistance and a broad process window, both for reflow and printing. This product has a high tack force to resist component movement during high speed placement and long printer abandon times. Good humidity resistance Clear residues for easy post-reflow inspection. Soft, non-stick, pin testable residues allow easy in-circuit testing Extended open time and tack-life leading to low wastage

Product Detail

New items

SMD291SNL, CHIPQUIK

Solder Paste no clean Lead-Free in 5cc syringe 15g w/plunger & tip. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test @1.56% RoHS II and REACH compliant

Product Detail

New items

SMD291AX50T3, CHIPQUIK

Solder Paste in jar 50g (T3) Sn63/Pb37 no clean 90.25% metal. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Print grade Compatible with enclosed print heads Passes BONO test

Product Detail

New items

SMD4300SNL10, CHIPQUIK

Solder Paste no clean Lead-Free in 10cc syringe 35g water washable w/plunger & tip. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test @1.56% RoHS II and REACH compliant

Product Detail

New items

SMD291AX, CHIPQUIK

Solder Paste no clean 63Sn/37Pb in 5cc syringe 15g w/plunger & tip. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test

Product Detail

New items

Loctite GC 10 T4, Loctite

The Loctite GC 10 is a halogen free, zero halogens added, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long term stability over a wide range of temperature conditions. The enhanced paste stability created through its novel formulation strategy increases both field application yields and on-line paste utilization. Halogen-free flux Suitable for high-speed printing up to 125 mms-1 Residues print testable after 4x reflows

Product Detail

New items

SMD291SNL10T5, CHIPQUIK

Solder Paste no clean Lead-Free in 10cc syringe T5 Mesh SAC305. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads Passes BONO test @1.56% RoHS II and REACH compliant

Product Detail

New items

SMD291SNL50T3, CHIPQUIK

Solder Paste in jar 50g (T3) SAC305 no clean 88.5% metal. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Print grade Compatible with enclosed print heads Passes BONO test @1.56% RoHS II and REACH compliant

Product Detail

New items

CW8700, Circuitworks

Lead Free Tacky Flux Specifically formulated for the higher temperature requirements of lead free applications Syringe applicator provides exact delivery of flux to surface Long tack time, extended shelf life No refrigeration required Noncorrosive, halide and halogen free Meets IPC requirements for ROL0, No Clean Excellent consistency with stable viscosity CW8700 3.5 gm (0.12 oz) Syringe Applications: Ideal for lead-free BGA rework applications requiring higher activation temperatures Standards ISO 9454, DIN EN 29454-1, RoHS Compliant Standards ISO 9454, DIN EN 29454-1, RoHS Compliant Syringes

Product Detail

New items

SMD291SNL250T3, CHIPQUIK

Solder Paste in jar 250g (T3) SAC305 no clean 88.5% metal. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Print grade Compatible with enclosed print heads Passes BONO test @1.56% RoHS II and REACH compliant

Product Detail

New items

SMDLTLFP, CHIPQUIK

Solder Paste Lead-Free Sn42/Bi57.6/Ag0.4 no clean Low Temperature Melts 138C 281F eutectic. Printing speeds up to 100mm/sec Long stencil life Wide process window Clear residue Low voiding Excellent wetting compatibility on most board finishes Dispense grade Compatible with enclosed print heads RoHS II and REACH compliant

Product Detail

New items

Loctite MP 218, Loctite

The Loctite MP 218 solder paste is a halide-free, no clean, pin testable solder paste, which has excellent humidity resistance and a broad process window, both for reflow and printing. LOCTITE MP 218 has high tack force to resist component movement during high speed placement, long printer abandon times and excellent solderability over a wide range of reflow profiles in air and nitrogen and across a wide range of surface finishes including HASL, Ni/Au, Immersion Sn, Immersion Ag and OSP copper. Colourless residues for easy post-reflow inspection Soft, non-stick, pin testable residues allow easy in-circuit testing Suitable for fine pitch, high speed printing up to 150mm/s (6"/s)

Product Detail

New Items

Loctite LF 318 96 SCA BK, Loctite

SMD291SNL, CHIPQUIK

SMD291AX50T3, CHIPQUIK

SMD4300SNL10, CHIPQUIK

SMD291AX, CHIPQUIK

Loctite GC 10 T4, Loctite

SMD291SNL10T5, CHIPQUIK

SMD291SNL50T3, CHIPQUIK

CW8700, Circuitworks

SMD291SNL250T3, CHIPQUIK

SMDLTLFP, CHIPQUIK

Loctite MP 218, Loctite

FAQs